Amanote Research
Register
Sign In
Properties of SnAgCu Solders Bearing Al Nanoparticles
doi 10.2991/peee-15.2015.49
Full Text
Open PDF
Abstract
Available in
full text
Date
January 1, 2015
Authors
L. Zhang
L. Sun
Y.H. Guo
Y. Min
Publisher
Atlantis Press
Related search
Heterogeneous Nucleation of Cu6Sn5 in Sn–Cu–Al Solders
Journal of Alloys and Compounds
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
Research of Interaction Between Zn Based Solders and Cu, Al Substrates
Research Papers Faculty of Materials Science and Technology Slovak University of Technology
Thermal Properties of Nanocrystalline Al Composites Reinforced by AlN Nanoparticles
Journal of Materials Research
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Hydration Properties of Cement Pastes With Al-Zinc Oxide and Zinc Oxide Nanoparticles
ES Materials & Manufacturing
Relationship Between Mechanical Properties of Lead-Free Solders and Their Heat Treatment Parameters
Journal of Materials Engineering and Performance
Mechanics of Materials
Materials Science
Mechanical Engineering
Effects of Aluminum (Al) Incorporation on Structural, Optical and Thermal Properties of ZnO Nanoparticles
Materials Science-Poland
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
In Situ Investigation of SnAgCu Solder Alloy Microstructure
Journal of Alloys and Compounds
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
Microstructure and Mechanical Properties of Partial Melted Joint Using Off Eutectic Lead-Free Solders
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Extraordinary Ductility in Al-Bearing -TRIP Steel
Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences
Mathematics
Engineering
Astronomy
Physics
