Diffusion Barrier Properties of Tungsten Nitride Films Grown by Atomic Layer Deposition From Bis(tert-Butylimido)bis(dimethylamido)tungsten and Ammonia
Applied Physics Letters - United States
doi 10.1063/1.1565699
Full Text
Open PDFAbstract
Available in full text
Date
April 7, 2003
Authors
Publisher
AIP Publishing