Amanote Research
Register
Sign In
Modeling of 3-Dimensional Defects in Integrated Circuits
doi 10.1109/dftvs.1992.224355
Full Text
Open PDF
Abstract
Available in
full text
Date
Unknown
Authors
J.P. de Gyvez
S.M. Dani
Publisher
IEEE Comput. Soc. Press
Related search
Thermal Model for Three-Dimensional Integrated Circuits With Integrated MLGNR-based TSV
Thermal Science
Renewable Energy
the Environment
Sustainability
Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
Electronic Engineering
Optical
Computer Science Applications
Electrical
Magnetic Materials
Electronic
Test-Pattern Selection for Screening Small-Delay Defects in Very-Deep Submicrometer Integrated Circuits
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Electrical
Software
Computer Graphics
Computer-Aided Design
Electronic Engineering
Dynamic Electrothermal Simulation of Three-Dimensional Integrated Circuits Using Standard Cell Macromodels
IET Circuits, Devices and Systems
Control
Systems Engineering
Electrical
Electronic Engineering
Photonic Integrated Circuits
Photonics Russia
Design, Modeling, and Optimization of ECL Interface Circuits for BiCMOS Integrated Systems.
Numerically Stable Green Function for Modeling and Analysis of Substrate Coupling in Integrated Circuits
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Electrical
Software
Computer Graphics
Computer-Aided Design
Electronic Engineering
Diamond-Integrated Optomechanical Circuits
Nature Communications
Astronomy
Genetics
Molecular Biology
Biochemistry
Chemistry
Physics
Laser Testing of Integrated Circuits
IEEE Journal of Solid-State Circuits
Electronic Engineering
Electrical
