Preliminary Experiments of Cu Interconnect Preparation by Magnetically Transported-Shielded Cathodic Arc Deposition
IEEJ Transactions on Fundamentals and Materials - Japan
doi 10.1541/ieejfms.123.462
Full Text
Open PDFAbstract
Available in full text
Date
January 1, 2003
Authors
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)