Special Articles: Theme of Advanced Assembly and Packaging Technology. Subject Imposed on Hybrid Microelectronics Engineers.

Circuit Technology
doi 10.5104/jiep1986.7.20
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Japan Institute of Electronics Packaging

Related search

Special Articles: Theme of Advanced Assembly and Packaging Technology. Breakthrough in Packaging Technology.

Circuit Technology
1992English

Microelectronics Packaging Technology Roadmaps, Assembly Reliability, and Prognostics

Facta universitatis - series: Electronics and Energetics
2016English

Microelectronics Packaging and Integration

MRS Bulletin
Materials ScienceTheoretical ChemistryCondensed Matter PhysicsPhysical
2003English

Special Technology Area Review on Microwave Packaging Technology

1993English

Semiconductor Packaging Technology for 3D Assembly

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2014English

Plan for Advanced Microelectronics Processing Technology Application. Final Report

1990English

Packaging Predictable Assembly With Prediction-Enabled Component Technology

2001English

Protocol: Gamify a Subject Without Advanced Technology

WPOM-Working Papers on Operations Management
2019English

Special Articles: Assembly Technology Trends of Smallest, Thinnest and Lightest Electronic Equipment by Thin Multilayer Boards. Portable Mobile Telephone.

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
1995English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2025 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy