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Influence of Copper Vapor Contamination on Dielectric Properties of Hot Air at 300-3500 K in Atmospheric Pressure
IEEE Transactions on Dielectrics and Electrical Insulation
- United States
doi 10.1109/tdei.2005.1453455
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Categories
Electronic Engineering
Electrical
Date
June 1, 2005
Authors
Y. Tanaka
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
