Porous Thick-Film Silver Metallisation for Thermally Mismatched Brazing Operations in Tokamak Magnetic Sensor

Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)
doi 10.4071/cicmt-wp15
Full Text
Abstract

Available in full text

Date
Authors
Publisher

International Microelectronics and Packaging Society (IMAPS)


Related search