Porous Thick-Film Silver Metallisation for Thermally Mismatched Brazing Operations in Tokamak Magnetic Sensor
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)
doi 10.4071/cicmt-wp15
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Date
April 1, 2015
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Publisher
International Microelectronics and Packaging Society (IMAPS)