Influence of Surface Cleanness on Ultrasonic Ball Bondability of Au Wire Onto Au, Cu and Al Pads. Study of Ultrasonic Bonding With Surface Cleaning by Ion Bombardment(Report 2).

Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society - Japan
doi 10.2207/qjjws.16.93
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Japan Welding Society

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