Amanote Research
Register
Sign In
A 3D Wideband Package Solution Using McM-D BCB Technology for Tile TR Module
doi 10.1109/eumc.2005.1610234
Full Text
Open PDF
Abstract
Available in
full text
Date
January 1, 2005
Authors
T. Barbier
F. Mazel
B. Reig
P. Monfraix
Publisher
IEEE
Related search
Package-Interposer-Package (PIP): A Breakthrough Package-On-Package (PoP) Technology for 3d-Integration
International Symposium on Microelectronics
The sROD Module for the ATLAS Tile Calorimeter Upgrade Demonstrator
Innovative 3D Visualization of Electro-Optic Data for MCM
Trends of MCM Application. Recent Technology Trends on MCM Organic Substrates.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Continuous Ultrafiltration/Diafiltration Using a 3D‐printed Two Membrane Single Pass Module
Biotechnology and Bioengineering
Applied Microbiology
Biotechnology
Bioengineering
Software Package for the Active Queue Management Module Model Verification
A New Method for Construction Supporting System Using Web-3d Technology
JOURNAL OF APPLIED COMPUTING IN CIVIL ENGINEERING
Speedup Using Flowpaths for a Finite Difference Solution of a 3D Parabolic PDE
Wideband Integrated Voice/Data Technology
