Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging
International Symposium on Microelectronics
doi 10.4071/isom-2012-wa63
Full Text
Open PDFAbstract
Available in full text
Date
January 1, 2012
Authors
Publisher
International Microelectronics and Packaging Society (IMAPS)