A Method of Determining Reliability Testing Conditions for Solder Joints of Electronic Devices.

Transactions of the Japan Society of Mechanical Engineers Series A
doi 10.1299/kikaia.62.1464
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Japan Society of Mechanical Engineers

Related search

Pb-Free High Temperature Solder Joints for Power Semiconductor Devices

Transactions of The Japan Institute of Electronics Packaging
2009English

The Current Situation and Challenges of Strength Reliability Evaluation for Solder Joints

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2012English

High Reliability Design for Micro Solder Joints by Means of Computational Mechanics.

Journal of SHM
1995English

A Method for Fatigue Life Evaluation of Solder for Electronic Equipments.

Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
1992English

New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction Between Design Factors

2007English

Solder Joints Detection Method Based on Surface Recovery

Computer and Information Science
2010English

Adaptive Classification Algorithm for EMC-compliance Testing of Electronic Devices

Electronics Letters
Electronic EngineeringElectrical
2013English

Experiences From Reliability Testing of Aircraft Electronic Equipment

Vojnotehnicki glasnik
2003English

Evaluation Method of Thermal Fatigue Life for Surface-Mount Solder Joints by Mechanical Fatigue Test.

Transactions of the Japan Society of Mechanical Engineers Series A
1995English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy