Amanote Research
Register
Sign In
Reduction of Resistivity in Cu Thin Films by Partial Oxidation: Microstructural Mechanisms
doi 10.2172/826466
Full Text
Open PDF
Abstract
Available in
full text
Date
October 14, 2003
Authors
W Prater
Publisher
Office of Scientific and Technical Information (OSTI)
Related search
CO Oxidation Mechanisms on CoOxPt Thin Films
Metastable Resistivity ofLa0.8Ca0.2MnO3manganite Thin Films
Physical Review B
Microstructural Characterization of Thin Films Obtained by Laser Irradiation
Microscopy Microanalysis Microstructures
Microstructural Characteristics of CuGaTe2polycrystalline Thin Films
Acta Crystallographica Section A Foundations of Crystallography
Effects of Cu on the Microstructural and Mechanical Properties of Sputter Deposited Ni-Ti Thin Films
Surface and Coatings Technology
Surfaces
Condensed Matter Physics
Interfaces
Materials Chemistry
Films
Coatings
Chemistry
Classical Size Effect in Oxide-Encapsulated Cu Thin Films: Impact of Grain Boundaries Versus Surfaces on Resistivity
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Surfaces
Films
Interfaces
Condensed Matter Physics
Coatings
Microstructural Characterization of Thick PZT Films on Cu Foils Deposited by Electrophoresis
Microscopy and Microanalysis
Instrumentation
Control of BaZrO3 Nanorod Alignment in YBa2Cu3O7−x Thin Films by Microstructural Modulation
Applied Physics Letters
Astronomy
Physics
Synthesis and Microstructural Characterization of SnO2:F Thin Films Deposited by AACVD
Materials Research
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering