Amanote Research

Amanote Research

    RegisterSign In

In Situ X-Ray Microscopy Studies of Electromigration in Copper Interconnects

AIP Conference Proceedings - United States
doi 10.1063/1.1622514
Full Text
Open PDF
Abstract

Available in full text

Categories
AstronomyPhysics
Date

January 1, 2003

Authors
G. Schneider
Publisher

AIP


Related search

Modeling the Electromigration Failure Time Distribution in Short Copper Interconnects

Journal of Applied Physics
AstronomyPhysics
2008English

In Situ High-Resolution Transmission Electron Microscopy of Electromigration in Silver Nanocontacts

2010English

Electromigration of Electroplated Gold Interconnects

Materials Research Society Symposium - Proceedings
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2005English

Dislocation Studies in Diamond by X-Ray Diffraction Microscopy

1963English

Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect Lines at the Advanced Light Source

2009English

In Situscanning-Tunneling-Microscopy Studies of Early-Stage Electromigration in Ag

Physical Review B
1993English

In Situ Transmission Electron Microscopy of Copper Electrodeposition

Microscopy and Microanalysis
Instrumentation
2002English

In Situ Studies of Passive Film Chemistry Using X-Ray Absorption Spectroscopy

Corrosion Science
Materials ScienceChemistryChemical Engineering
1993English

In Situ Methods for Analysis of Polymer Electrolyte Membrane Fuel Cell Materials by Soft X-Ray Scanning Transmission X-Ray Microscopy

Microscopy and Microanalysis
Instrumentation
2014English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2025 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy