Amanote Research
Register
Sign In
In Situ X-Ray Microscopy Studies of Electromigration in Copper Interconnects
AIP Conference Proceedings
- United States
doi 10.1063/1.1622514
Full Text
Open PDF
Abstract
Available in
full text
Categories
Astronomy
Physics
Date
January 1, 2003
Authors
G. Schneider
Publisher
AIP
Related search
Modeling the Electromigration Failure Time Distribution in Short Copper Interconnects
Journal of Applied Physics
Astronomy
Physics
In Situ High-Resolution Transmission Electron Microscopy of Electromigration in Silver Nanocontacts
Electromigration of Electroplated Gold Interconnects
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Dislocation Studies in Diamond by X-Ray Diffraction Microscopy
Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect Lines at the Advanced Light Source
In Situscanning-Tunneling-Microscopy Studies of Early-Stage Electromigration in Ag
Physical Review B
In Situ Transmission Electron Microscopy of Copper Electrodeposition
Microscopy and Microanalysis
Instrumentation
In Situ Studies of Passive Film Chemistry Using X-Ray Absorption Spectroscopy
Corrosion Science
Materials Science
Chemistry
Chemical Engineering
In Situ Methods for Analysis of Polymer Electrolyte Membrane Fuel Cell Materials by Soft X-Ray Scanning Transmission X-Ray Microscopy
Microscopy and Microanalysis
Instrumentation