Singular Stress Fields at Corners in Flip-Chip Packages

Engineering Fracture Mechanics - Netherlands
doi 10.1016/j.engfracmech.2012.02.010
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Elsevier BV

Related search

Reliability of Flip Chip Package^|^mdash;Thermal Stress on Flip Chip Joint^|^mdash;

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2013English

Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)

IEEE Transactions on Electronics Packaging Manufacturing
2007English

Analysis of Chip/Bump/Ceramic Interface of Flip-Chip Bonded LED Directly on Ceramic Packages

Journal of Light and Visual Environment
Electronic EngineeringElectrical
2008English

Development of the Singular Stress Analyses for Three-Dimensional Interfacial Corners

Transactions of the JSME (in Japanese)
2017English

Trend of BGACSPKGD. Flip-Chip Chip Size/Scale Package.

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
1998English

Millimeter-Wave Flip-Chip IC Module.

Journal of SHM
1997English

Investigation of Flip-Chip Bonding for MEMS Applications

Journal of Electronic Packaging, Transactions of the ASME
Mechanics of MaterialsElectronic EngineeringOpticalComputer Science ApplicationsElectricalMagnetic MaterialsElectronic
2004English

Solder Paste Reflow Modeling for Flip Chip Assembly

English

DEVELOPMENT OF FLIP CHIP TECHNIQUES FOR CONSTRUCTING MONOLITHIC MULTI-CHIP ARRAYS. Final Report.

1967English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy