Study on Bonding of Heat-Resisting Fine Creamics (Report8). Kinetics of the Growth of Reaction Layer at the Bonding Interface of Si3N4 to Metal Joints.
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society- Japan
doi 10.2207/qjjws.7.537
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January 1, 1989
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Japan Welding Society