Copper Surface Analyses After Cu CMP Processing

Electrochemistry - Japan
doi 10.5796/electrochemistry.72.569
Full Text
Abstract

Available in full text

Date
Authors
Publisher

The Electrochemical Society of Japan

Related search

Copper CMP Mimicked With Atomic Force Microscopy

2005English

Real Time Monitor of Cu Pollution in Clean Room Ambient Near Cu CMP Equipment

English

Mechanical Removal in CMP of Copper Using Alumina Abrasives

Journal of the Electrochemical Society
SurfacesCondensed Matter PhysicsOpticalElectrochemistrySustainabilityMaterials ChemistryMagnetic MaterialsRenewable EnergyFilmsCoatingsElectronicthe Environment
2004English

Immobilized Cu Adatoms: Amino Acid Immobilization of Copper Surface Diffusion on Cu(111) (Adv. Mater. Interfaces 7/2019)

Advanced Materials Interfaces
Mechanics of MaterialsMechanical Engineering
2019English

Surface Ruggedness Processing of Cylindrical Cu-Zn Wire With Wet Blasting

2009English

Window-Controlled CMP Crosscorrelation Analysis for Surface Waves in Laterally Heterogeneous Media

Geophysics
PetrologyEnergyGeochemistryGeophysics
2013English

The Ag−Cu (Silver-Copper) System

Bulletin of Alloy Phase Diagrams
1980English

Al-Au-Cu (Aluminum-Gold-Copper)

Journal of Phase Equilibria and Diffusion
AlloysMaterials ChemistryCondensed Matter PhysicsMetals
2010English

Tetra-Μ-Benzoato-Bis[(3-Methylquinoline)copper(II)](Cu—Cu)

Acta Crystallographica Section E Structure Reports Online
2008English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy