Liquid Cooling of Non-Uniform Heat Flux of a Chip Circuit by Subchannels
Applied Thermal Engineering- United Kingdom
doi 10.1016/j.applthermaleng.2016.12.061
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March 1, 2017
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Elsevier BV
doi 10.1016/j.applthermaleng.2016.12.061
Available in
March 1, 2017
Elsevier BV