Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn–Ag–Cu Solder Joints During Thermal Cycling
Materials Transactions - Japan
doi 10.2320/matertrans.mbw201206
Full Text
Open PDFAbstract
Available in full text
Date
January 1, 2013
Authors
Publisher
Japan Institute of Metals