Testing of Vapour Chamber Used in Electronics Cooling

WIT Transactions on Engineering Sciences - United Kingdom
doi 10.2495/ht060271
Full Text
Abstract

Available in full text

Date
Authors
Publisher

WIT Press

Related search

Potential Refrigerants for Power Electronics Cooling

2005English

Boiling of Immiscible Mixtures for Cooling of Electronics

2016English

Towards Structural Testing of Superconductor Electronics

English

Electrostatic Discharge Risks in Electronics Used in Automotive Application

International Journal of Automotive Engineering and Technologies
2014English

Using Annealed Pyrolytic Graphite in Conduction Cooled Electronics Cooling Applications

English

Heat and Water Vapour Transfer Trough the Envelope of a Cold Chamber

Journal of Environmental Science and Engineering A
2016English

Thermal Analysis of Semi-Circular Pin Fins for Application in Electronics Cooling

International Journal of Recent Technology and Engineering
EngineeringManagement of TechnologyInnovation
2019English

Upgrade of the ATLAS Thin Gap Chamber Electronics for HL-LHC

Springer proceedings in physics
High Energy PhysicsNuclear
2018English

Nano-Coated Heat Pipe Plate for Miniaturized Electronics Cooling

2019English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2025 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy