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Steady State Thermal Conductivity Measurement Method of Specimens in Thickness and In-Plane Direction ~ Thermal Conductivity Measurement of TIMs and Multi-Layer Printed Wiring Boards ~
Journal of Japan Institute of Electronics Packaging
- Japan
doi 10.5104/jiep.18.61
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Categories
Electronic Engineering
Electrical
Date
January 1, 2015
Authors
Unknown
Publisher
Japan Institute of Electronics Packaging
