(PDF) Development of Computing Methods for Analysis of

Development of Computing Methods for Analysis of Joining-Induced Thermal Conduction, Residual Stress and Deformation in Thin Plates

Journal of Smart Processing

doi 10.7791/jspmee.7.14

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Abstract

Available in full text

Date

January 1, 2018

Authors

Hisashi SERIZAWA

Publisher

Sumart Processing Society for Minerals, Environment and Energy

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