Ensuring Suitability of Cu Wire Bonded ICs for Automotive Applications

International Symposium on Microelectronics
doi 10.4071/isom-2015-poster8
Full Text
Abstract

Available in full text

Date
Authors
Publisher

International Microelectronics and Packaging Society (IMAPS)

Related search

Efficient Substrate Noise Coupling Verification and Failure Analysis Methodology for Smart Power ICs in Automotive Applications

IEEE Transactions on Power Electronics
Electronic EngineeringElectrical
2017English

Hybrids for Automotive Applications

ElectroComponent Science and Technology
1983English

Contactless Interaction for Automotive Applications

English

Ensuring the Reliability of Threaded Connections on Modern Automotive Vehicles

Traktory i sel'hozmashiny
2019English

Design of an Integrated Antenna for Automotive Applications

2005English

Ensuring Continuous Improvement Processes Through Standardization in the Automotive Company

Production Engineering Archives
2014English

Printed Wideband Antenna for LTE-Band Automotive Applications

IEEE Antennas and Wireless Propagation Letters
Electronic EngineeringElectrical
2017English

Interface Structure of Cu Wire Bonding on Cu Substrate With Sn Plating

Materials Transactions
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2012English

Improving the Performance of Magnesium Alloys for Automotive Applications

2014English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy