Stress Relaxation in 60Sn-40Pb Solder Joints

Journal of Electronic Materials - United States
doi 10.1007/bf02652123
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Springer Science and Business Media LLC

Related search

Strength Evaluation and Realiability of Micro-Joining. Fatigue Behavior of 60Sn/40Pb Solder.

Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
1992English

Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity.

Transactions of the Japan Society of Mechanical Engineers Series A
1996English

Properties of Sn-Ag-Bi-In Solder Joints

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of MaterialsAlloysMaterials ChemistryCondensed Matter PhysicsMetals
2005English

Solder Joints Detection Method Based on Surface Recovery

Computer and Information Science
2010English

Microstructural Evolution of Eutectic Au-Sn Solder Joints

2002English

Deformation Evaluation of Solder Ball Joints by Electromotive Force

Applied Mechanics and Materials
2008English

Residual Stress Relaxation in Typical Weld Joints and Its Effect on Fatigue and Crack Growth

Acta Metallurgica Sinica (English Letters)
AlloysIndustrialManufacturing EngineeringMetals
2009English

The Characteristics of Electromigration and Thermomigration in Flip Chip Solder Joints

2007English

The Effect of Solder Paste Viscosity on Porosity and Mechanical Properties of Surface Mount Solder Joints

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
1997English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy