X 線回折法による半導体パッケージ用封止樹脂／銅界面の残留応力評価
Seikei-Kakou
doi 10.4325/seikeikakou.29.159
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Date
May 20, 2017
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The Japan Society of Polymer Processing
Available in full text
May 20, 2017
The Japan Society of Polymer Processing