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Development of Microwave Package Models Utilizing On-Wafer Characterization Techniques
IEEE Transactions on Microwave Theory and Techniques
- United States
doi 10.1109/22.641800
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Abstract
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Categories
Electronic Engineering
Radiation
Electrical
Condensed Matter Physics
Date
January 1, 1997
Authors
C. Chun
A. Pham
J. Laskar
B. Hutchison
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
