NCMS PWB Program Report Surface Finishes Team Task WBS No. 3.1.1: Phase 1, Etching Studies: Chemical Etching of Copper for Improved Solderability

doi 10.2172/94674
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Office of Scientific and Technical Information (OSTI)

Related search

A Novel Chemical Etching Reagent for Copper.

Journal of the Metal Finishing Society of Japan
1987English

Feedback Control of Plasma Etching Reactors for Improved Etching Uniformity

Chemical Engineering Science
Applied MathematicsChemistryChemical EngineeringManufacturing EngineeringIndustrial
2001English

Chemical Etching of Silicon

Microscopy Today
1997English

New Etching System Using Alkylimidazolato Copper(II) Film as Etching Resist.

Circuit Technology
1988English

Chemical Etching and Plating Characteristics of Vapor Deposited Copper Film Using High Purity Copper Sources.

Journal of the Surface Finishing Society of Japan
1997English

Studies of Membrane Structure by Freeze--Etching. Progress Report, 1 July 1974--30 June 1975

1975English

Surface Chemistry During Plasma Etching of Silicon

Pure and Applied Chemistry
ChemistryChemical Engineering
1996English

Chemical Foaming Coupled Self-Etching: A Multiscale Processing Strategy for Ultrahigh-Surface-Area Carbon Aerogels

English

Anisotropic Chemical Etching of III—V Crystals Dissolution Slowness Surface and Application to GaAs

Active and Passive Electronic Components
Electronic EngineeringOpticalElectricalMagnetic MaterialsElectronic
2004English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy