Technology Trend of High Heat Dissipation AlN Substrate for Semiconductor Device

Journal of Japan Institute of Electronics Packaging - Japan
doi 10.5104/jiep.15.185
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Japan Institute of Electronics Packaging

Related search

CMP Technology for Interconnect of Semiconductor Device

Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
2007English

Co-Fired AlN–TiN Assembly as a New Substrate Technology for High-Temperature Power Electronics Packaging

Ceramics International
SurfacesOpticalMaterials ChemistryProcess ChemistryTechnologyMagnetic MaterialsFilmsCompositesElectronicCoatingsCeramics
2013English

Heat Dissipation Mechanism at Carbon Nanotube Junctions on Silicon Oxide Substrate

Journal of Heat Transfer
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2014English

Forced Air-Cooling for CPU Modules With High Heat Dissipation.

Nihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B
Condensed Matter PhysicsMechanical Engineering
2001English

A Modular High Temperature Measurement Set-Up for Semiconductor Device Characterization

2007English

Introduction of the Latest Activity of Device Embedded Substrate Technology Committee

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2016English

Semiconductor Device Concepts

1962English

Research and Application of Thermoelectric Energy Conversion Device Based on Heat Dissipation of Coal Pile

Energy and Environment Research
2019English

Erratum For: An On-Wafer Embedded Passive Device Using Chip-In-Substrate Packaging Technology

Microwave and Optical Technology Letters
Electronic EngineeringCondensed Matter PhysicsElectronicMolecular Physics,OpticalElectricalAtomicMagnetic MaterialsOptics
2015English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy