Liquid-Solid Contact in Microbubble Emission Boiling Through Void Signals.

Nihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B - Japan
doi 10.1299/kikaib.67.2304
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Japan Society of Mechanical Engineers

Related search

Microbubble Emission Boiling on a Horizontal Upward-Facing Rectangular Surface in Subcooled Flow.

JSME International Journal
Engineering
1987English

Heat Transfer of a Liquid-Solid Contact in a Subcooled Pool Boiling System. The Second Burnout Regime.

JSME International Journal
Engineering
1987English

Dielectric Behavior of Low Boiling Chlorides in the Liquid, Solid, and Adsorbed States

Canadian Journal of Chemistry
Organic ChemistryCatalysisChemistry
1968English

Boiling a Unitary Fermi Liquid

Physical Review Letters
AstronomyPhysics
2019English

Prediction of the Onset of Significant Void in Transient Subcooled Flow Boiling

1993English

Boiling of Binary Liquid Mixtures

Transactions of the Japan Society of Mechanical Engineers
1972English

Modeling of the Thermal Contact Resistance of a Solid-Solid Contact

IOSR Journal of Mechanical and Civil Engineering
2014English

Three-Dimensional Wave Propagation Through Single Crystal Solid–liquid Interfaces

Journal of the Acoustical Society of America
AcousticsUltrasonicsArtsHumanities
1998English

Experimental Analysis of Local Void Fraction Measurements for Boiling Hydrocarbons in Complex Geometry – Discussion

International Journal of Multiphase Flow
Transfer ProcessesFluid FlowAstronomyPhysicsMechanical Engineering
2008English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy