Direct Wafer Bonding of Highly Conductive GaSb/GaInAs and GaSb/GaInP Heterojunctions Prepared by Argon-Beam Surface Activation
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films - United States
doi 10.1116/1.4947118
Full Text
Open PDFAbstract
Available in full text
Date
May 1, 2016
Authors
Publisher
American Vacuum Society