Development and Application of Molded Interconnect Devices

International Journal of Robotics Applications and Technologies
doi 10.4018/ijrat.2014010101
Full Text
Abstract

Available in full text

Date
Authors
Publisher

IGI Global

Related search

Circuit Pattern Structuring of Molded Interconnect Devices by Transmission Laser Beam

Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
2010English

Self-Organized Interconnect Method for Molecular Devices

English

Sofc Interconnect Development

2003English

Laser Microprocessing Technology and Its Application for Development of Medical Devices

THE JOURNAL OF JAPAN SOCIETY FOR LASER SURGERY AND MEDICINE
1999English

All-Zigzag Graphene Nanoribbons for Planar Interconnect Application

Journal of Applied Physics
AstronomyPhysics
2017English

Developing Offloading-Enabled Application Development Frameworks for Android Mobile Devices

2018English

A New Hybrid Method for H2s-Sensitive Devices Using WO3-based Film and ACF Interconnect

Measurement Science and Technology
InstrumentationEngineeringApplied Mathematics
2013English

Growth and Properties of InGaAs/FeAl/InAlAs/InP Heterostructures for Buried Reflector/Interconnect Applications in InGaAs Thermophotovoltaic Devices

1999English

Subdiffraction Instrumentation Development and Application to the Elucidation of Biological Systems, Thin Films, and Organic Photovoltaic Devices

English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy