Simulation Research on Solder Joint Residual Strain Energy of Au80/Sn20 Eutectic Soldering GaAs Chip

doi 10.2991/icismme-15.2015.306
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Atlantis Press

Related search

A Modified Energy-Based Low Cycle Fatigue Model for Eutectic Solder Alloy

Scripta Materialia
Mechanics of MaterialsMaterials ScienceAlloysCondensed Matter PhysicsMechanical EngineeringMetalsNanoscienceNanotechnology
1999English

Microstructural Evolution of Eutectic Au-Sn Solder Joints

2002English

Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package With Underfill

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of MaterialsAlloysMaterials ChemistryCondensed Matter PhysicsMetals
2008English

Residual Strain in Welded Joint of Pre-Strained Steel Plate

2015English

Effect of Addition of Cu on the Properties of Eutectic Sn-Bi Solder Alloy

Materials Science-Poland
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2019English

Joint Consideration of Fault-Tolerance, Energy-Efficiency and Performance in On-Chip Networks

2007English

Influence of Humidity on Voids Formation Inside the Solder Joint

Advanced Science, Engineering and Medicine
2013English

Residual Stress Field of Triangular Symmetrical Composite Eutectic

DEStech Transactions on Materials Science and Engineering
2017English

Solder Paste Reflow Modeling for Flip Chip Assembly

English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy