Surge Endurance Characteristics Between Foil Conductors on Printed Wiring Board

IEEJ Transactions on Fundamentals and Materials - Japan
doi 10.1541/ieejfms.123.1130
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Related search

Multilayer Printed Wiring Board Lamination

1980English

Automatic Inspection System for Printed Wiring Board Patterns.

The Journal of the Institute of Television Engineers of Japan
1985English

The Consideration for Automatic Exposure Equipment of Printed Wiring Board.

Circuit Technology
1988English

Investigation of Small-Diameter Drilling of GFRP for Printed Wiring Board

Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Mechanics of MaterialsIndustrialMechanical EngineeringManufacturing Engineering
1997English

Filament Formation on Printed Wiring Boards

1975English

Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Tin-Lead Plating Technology for Printed Wiring Board.

Journal of the Surface Finishing Society of Japan
1993English

Laser Drilling of Printed-Wiring Boards

Circuit Technology
1990English

Special Issue/Plating on Engineering Plastics. Printed Wiring Boards.

Jitsumu Hyomen Gijutsu
1986English

Drillability of Multilayer Printed Wiring Boards.

Circuit Technology
1988English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2026 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy