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Effect of Oxygen Inclusion on Microstructure and Thermal Stability of Copper Nitride Thin Films
Journal of Materials Research
- United Kingdom
doi 10.1557/jmr.2007.0414
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Categories
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Date
November 1, 2007
Authors
Y. Du
R. Huang
R. Song
L.B. Ma
C. Liu
C.R. Li
Z.X. Cao
Publisher
Cambridge University Press (CUP)
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