Recent Trend of Reliability Technology. Evaluation of Strength Reliability of Plastic Packaging.

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
doi 10.5104/jiep1995.12.391
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Japan Institute of Electronics Packaging

Related search

Microelectronics Packaging Technology Roadmaps, Assembly Reliability, and Prognostics

Facta universitatis - series: Electronics and Energetics
2016English

Trends in High Density Packaging Technologies. Trends in Evaluation of Reliability With High Density Packaging Technologies-Present and Future in Evaluation of Reliability.

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
1997English

The Current Situation and Challenges of Strength Reliability Evaluation for Solder Joints

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2012English

Reliability Evaluation of Engineering Systems.

The Statistician
1994English

Strength Reliability of Micro Polycrystalline Silicon Structure

Key Engineering Materials
Mechanics of MaterialsMaterials ScienceMechanical Engineering
2007English

Recent Advances in Reliability Theory

2000English

Recent Activities in Semiconductor Packaging Technology

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2007English

Dynamic Reliability Evaluation for a Multi-State Component Under Stress-Strength Model

Journal of Nonlinear Science and Applications
Number TheoryAnalysisAlgebra
2017English

A Reliability Evaluation System of Association Rules

ISPRS Annals of the Photogrammetry, Remote Sensing and Spatial Information Sciences
InstrumentationEarthPlanetary SciencesEnvironmental Science
2016English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy