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Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress

IEEE Transactions on Power Electronics - United States
doi 10.1109/tpel.2017.2690500
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Abstract

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Categories
Electronic EngineeringElectrical
Date

March 1, 2018

Authors
Ui-Min ChoiFrede BlaabjergSoren Jorgensen
Publisher

Institute of Electrical and Electronics Engineers (IEEE)


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