Method for Evaluation of Bridge on Fine-Pitch Micro-Soldering.

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
doi 10.5104/jiep1995.12.236
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Japan Institute of Electronics Packaging

Related search

Special Atricles: The Micro Soldering Technology of Super High Density Packaging. The Mechanism of Migration Phenomenon for Fine Pitch Packaging.

Circuit Technology
1994English

Development of Pb-Sn Base Alloy Wires for Fine and Precise Pitch Soldering and New Bump Formation Method.

Materia Japan
1994English

Mount Process of Fine-Pitch QFP for SMT.

HYBRIDS
1991English

Surface Mount Technology Fine Pitch BGA.

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2001English

Evaluation of Micro-Esr Method With Westergren Method for Determination of Erythrocyte Sedimentation Rate

International Journal of Research in Medical Sciences
2018English

Bridge-Pier Safety Evaluation Method Using Nondestructive Impact Tests

2019English

Evaluation of Micro-Crack Distribution Using Inverse Homogenization Method

Journal of Japan Society of Civil Engineers, Ser. A2 (Applied Mechanics (AM))
2016English

A Novel Method for Stress Evaluation in Chemically Strengthened Glass Based on Micro-Raman Spectroscopy

Communications Physics
AstronomyPhysics
2020English

Evaluation of the Fine Fraction Content Using Electrical Logging Method

AIJ Journal of Technology and Design
BuildingConstructionArchitecture
2015English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy