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Dislocation Structure in Low-Angle Interfaces Between Bonded Si(001) Wafers
Journal of Materials Science
- Netherlands
doi 10.1023/b:jmsc.0000025829.40338.04
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Categories
Mechanics of Materials
Materials Science
Mechanical Engineering
Date
May 1, 2004
Authors
T. Akatsu
R. Scholz
U. Gösele
Publisher
Springer Nature