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Bayesian Surrogates for Integrating Numerical, Analytical, and Experimental Data: Application to Inverse Heat Transfer in Wearable Computers
IEEE Transactions on Components and Packaging Technologies
doi 10.1109/6144.833038
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Date
March 1, 2000
Authors
N. Leoni
C.H. Amon
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
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