Amanote Research
Register
Sign In
Addition Agents in Copper Electrotyping Solutions
Bureau of Standards Journal of Research
doi 10.6028/jres.005.046
Full Text
Open PDF
Abstract
Available in
full text
Date
July 1, 1930
Authors
R.O. Hull
W. Blum
Publisher
National Institute of Standards and Technology (NIST)
Related search
Recent Advances in Enantioselective Copper-Catalyzed 1,4-Addition
Chemical Society Reviews
Chemistry
The Interaction Between Copper Species and Pyrite Surfaces in Copper Cyanide Solutions
International Journal of Mineral Processing
Petrology
Geotechnical Engineering
Geochemistry
Engineering Geology
The Self Assembly of Superhydrophobic Copper Thiolate Films on Copper in Thiol Solutions
Zeitschrift fur Physikalische Chemie
Theoretical Chemistry
Physical
Role of Copper Transporters in Resistance to Platinating Agents
Cancer Chemotherapy and Pharmacology
Cancer Research
Toxicology
Oncology
Pharmacology
Anodic Behavior of Copper in NaCl Aqueous Solutions
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Laser-Induced Copper Deposition With Weak Reducing Agents
Copper Ions Are Novel Therapeutic Agents for Uterine Leiomyosarcoma
American Journal of Obstetrics and Gynecology
Gynecology
Obstetrics
Addition Theorems for Solutions of the Wave Equation in Parabolic Coordinates
Pacific Journal of Mathematics
Mathematics
Effects of Copper Addition on Copper Resistance, Antibiotic Resistance Genes, and Intl1 During Swine Manure Composting
Frontiers in Microbiology
Microbiology