Amanote Research
Register
Sign In
3D Vertical Integration Technologies for Advanced Semiconductor Radiation Sensors and Readout Electronics
doi 10.1109/iwasi.2011.6004681
Full Text
Open PDF
Abstract
Available in
full text
Date
June 1, 2011
Authors
Valerio Re
Publisher
IEEE
Related search
Readout Electronics for Pixel Detectors in Deep Submicron and 3D Technologies
International Journal of Electronics and Telecommunications
All Oxide Semiconductor-Based Bidirectional Vertical P-N-P Selectors for 3D Stackable Crossbar-Array Electronics
Scientific Reports
Multidisciplinary
Radiation-Tolerant, SRAM-FPGA Based Trigger and Readout Electronics for the ALICE Experiment
Advanced Semiconductor Dosimetry in Radiation Therapy
3D Electronics: 3D Sidewall Integration of Ultrahigh‐Density Silicon Nanowires for Stacked Channel Electronics (Adv. Electron. Mater. 7/2019)
Advanced Electronic Materials
Optical
Electronic
Magnetic Materials
3D Integration at Radiation Imaging Detectors
A Differential Electrochemical Readout ASIC With Heterogeneous Integration of Bio-Nano Sensors for Amperometric Sensing
IEEE Transactions on Biomedical Circuits and Systems
Electrical
Biomedical Engineering
Electronic Engineering
Nanoscale Semiconductor Electronics
Semiconductor Materials and Processing for Automotive Electronics.
Materia Japan