Amanote Research
Register
Sign In
Stress-Minimized Packaging of Inertial Sensors Using Wire Bonding
doi 10.1109/transducers.2013.6627179
Full Text
Open PDF
Abstract
Available in
full text
Date
June 1, 2013
Authors
S. Schroder
A. Nafari
K. Persson
E. Westby
A. C. Fischer
G. Stemme
F. Niklaus
S. Haasl
Publisher
IEEE
Related search
Magnetometer Calibration Using Inertial Sensors
IEEE Sensors Journal
Electronic Engineering
Electrical
Instrumentation
Wire Bonding Using Offline Programming Method
Engineering
Wire Bonding Using Offline Programming Method
Engineering
Estimating Stair Running Performance Using Inertial Sensors
Sensors
Instrumentation
Information Systems
Electronic Engineering
Biochemistry
Analytical Chemistry
Molecular Physics,
Electrical
Atomic
Medicine
Optics
Assessment of Hand Kinematics Using Inertial and Magnetic Sensors
Journal of NeuroEngineering and Rehabilitation
Rehabilitation
Health Informatics
Walking Distance Estimation Using Walking Canes With Inertial Sensors
Sensors
Instrumentation
Information Systems
Electronic Engineering
Biochemistry
Analytical Chemistry
Molecular Physics,
Electrical
Atomic
Medicine
Optics
Vacuum Packaging Technology Using Localized Aluminum/Silicon-to-Glass Bonding
Journal of Microelectromechanical Systems
Electronic Engineering
Electrical
Mechanical Engineering
Inertial Sensors for Smartphones Navigation
SpringerPlus
Multidisciplinary
Bio-Inspired Hair-Based Inertial Sensors
