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Stress-Minimized Packaging of Inertial Sensors Using Wire Bonding
doi 10.1109/transducers.2013.6627179
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Date
June 1, 2013
Authors
S. Schroder
A. Nafari
K. Persson
E. Westby
A. C. Fischer
G. Stemme
F. Niklaus
S. Haasl
Publisher
IEEE