Evaluation of Polystyrene Bead Foam as an Encapsulant for Electonic Packages. Final Report
doi 10.2172/6213009
Full Text
Abstract
Available in
Date
January 1, 1979
Authors
Publisher
Office of Scientific and Technical Information (OSTI)
doi 10.2172/6213009
Available in
January 1, 1979
Office of Scientific and Technical Information (OSTI)