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Comparison of Novel Cleaning Solutions With Various Chelating Agents for Post-CMP Cleaning on Poly-Si Film

IEEE Transactions on Semiconductor Manufacturing - United States
doi 10.1109/66.964323
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Abstract

Available in full text

Categories
Electronic EngineeringIndustrialCondensed Matter PhysicsManufacturing EngineeringOpticalElectricalMagnetic MaterialsElectronic
Date

January 1, 2001

Authors

Unknown

Publisher

Institute of Electrical and Electronics Engineers (IEEE)


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