(PDF) Non-Destructive Thickness Mapping of Wafer-Scale

Non-Destructive Thickness Mapping of Wafer-Scale Hexagonal Boron Nitride Down to a Monolayer

ACS Applied Materials & Interfaces - United States

doi 10.1021/acsami.8b08609

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Abstract

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Categories

Materials Science

Date

July 6, 2018

Authors

Andrea Crovetto

Patrick Rebsdorf Whelan

Miriam Galbiati

Stephan Hofmann

Publisher

American Chemical Society (ACS)

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