Investigations Into Packaging Technology for Membrane-Based Thermal Flow Sensors

Journal of Sensors and Sensor Systems - Germany
doi 10.5194/jsss-4-45-2015
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Copernicus GmbH

Related search

Hot-Film and Calorimetric Thermal Air Flow Sensors Realized With Printed Board Technology

Journal of Sensors and Sensor Systems
Electronic EngineeringElectricalInstrumentation
2016English

Semiconductor Packaging Technology for 3D Assembly

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2014English

Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach

ElectroComponent Science and Technology
1984English

An Universal Packaging Technique for Low-Drift Implantable Pressure Sensors

Biomedical Microdevices
NanotechnologyBiomedical EngineeringMolecular BiologyNanoscience
2016English

SLC/FCA Packaging Technology.

Journal of SHM
1993English

[Geothermal Resource/Reservoir Investigations Based on Heat Flow and Thermal Gradient Data for the US]. 6. Quarterly Technical Progress Report

1998English

Special Articles: Theme of Advanced Assembly and Packaging Technology. Breakthrough in Packaging Technology.

Circuit Technology
1992English

Editorial for Journal of Packaging Technology and Research

Journal of Packaging Technology and Research
2019English

Editorial for Journal of Packaging Technology and Research

Journal of Packaging Technology and Research
2018English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy