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Publications by A. Hsia
Stresses From Flip-Chip Assembly and Underfill; Measurements With the ATC4.1 Assembly Test Chip and Analysis by Finite Element Method
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Trend of BGACSPKGD. Flip-Chip Chip Size/Scale Package.
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Analysis of Chip/Bump/Ceramic Interface of Flip-Chip Bonded LED Directly on Ceramic Packages
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Millimeter-Wave Flip-Chip IC Module.
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