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Publications by A. Philipossian
Effect of Slurry Flow Rate on Tribological, Thermal, and Removal Rate Attributes of Copper CMP
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
Viewing Asperity Behavior Under the Wafer During CMP
Electrochemical and Solid-State Letters
Related publications
Mechanical Removal in CMP of Copper Using Alumina Abrasives
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
Stochastic Models for Material Removal Rate (MRR) in Chemical Mechanical Planarization (CMP) Process
Effect of Stress on the Composition and Flow Rate of Saliva
Al-Rafidain Dental Journal
Effect of Overseas Debt and Interest Rate Rate of Exchange Rate Rate (Exchange Rate)
Develop
Correlating Removal Rate to Directivity in Copper Chemical Mechanical Planarization
ECS Journal of Solid State Science and Technology
Optical
Electronic
Magnetic Materials
Effect of Potassium on Renal Vascular Resistance and Urine Flow Rate
American Journal of Physiology-Legacy Content
Effects of Isothermal and Adiabatic Thermal Loadings on Size and Strain Rate Dependence of Copper Nanowire
Defence Science Journal
Electronic Engineering
Mechanical Engineering
Physics
Computer Science Applications
Electrical
Chemical Engineering
Astronomy
Biomedical Engineering
Impeller Radial Velocity and Air Flow Rate Influence on Copper Rougher Flotation Recovery
Civil and Environmental Engineering Reports
Effect of Cooling Rate, Thermal Expansion, and Waste Loading on Glass Fracture
