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Publications by Adam M. Boyce
On the Indentation Resistance of a PC Layer on PVC Foam Substrate
Advanced Engineering Materials
Materials Science
Condensed Matter Physics
Related publications
A Study on Resistance Factors of Pc (Prc) Members
AIJ Journal of Technology and Design
Building
Construction
Architecture
Microstructure and Resistance to Abrasive and Corrosive Wear of a Chromosiliconized Layer on C45 Steel Substrate
Tribologia
Indentation Rolling Resistance Based on a Three-Parameter Kelvin Solid Model
Advances in Mechanical Engineering
Mechanical Engineering
Thermocapillary Rupture of a Horizontal Liquid Layer on a Silicon Substrate
EPJ Web of Conferences
Astronomy
Physics
Thin Film Pc-Si by Aluminium Induced Crystallization on Metallic Substrate
EPJ Photovoltaics
Electronic Engineering
Condensed Matter Physics
Renewable Energy
Sustainability
Optical
Electrical
Magnetic Materials
Electronic
the Environment
Morphology and Properties of the Graphene Layer on the Copper Substrate
Polish Journal of Chemical Technology
Biotechnology
Chemistry
Chemical Engineering
The Impact of GaN/Substrate Thermal Boundary Resistance on a HEMT Device
Research of Indentation Resistance of Geosynthetic
PNRPU Construction and Architecture Bulletin
A Wide-Band Compact Quadrature Coupler on Multi-Layer Package Substrate
Progress In Electromagnetics Research Letters
Optical
Electronic
Magnetic Materials
