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Publications by Akemi Kano
Development of a Curable Conductive Copper Paste in Air
Transactions of The Japan Institute of Electronics Packaging
Related publications
Application of Copper Microfibers to Conductive Paste
IEEJ Transactions on Fundamentals and Materials
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A Development Methodology for Copper End Termination Paste — Part 1: Origin of Green Defects
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Magnetic Materials
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Development of the Conductive Paste With Highly Dispersed Ag-Pd Prealloyed Powders on Glass Ceramic Substrates.
DENKI-SEIKO[ELECTRIC FURNACE STEEL]
Copper Nanowires as Fully Transparent Conductive Electrodes
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High Strength High Conductive Copper Base In-Situ Composites.
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Joining of Pure Copper Using Cu Nanoparticles Derived From CuO Paste
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Reactivity of NO2 With Porous and Conductive Copper Azobispyridine Metallopolymers
Formate-Free Metal-Organic Decomposition Inks of Copper Particles and Self-Reductive Copper Complex for the Fabrication of Conductive Copper Films
Journal of Coating Science and Technology
The Effect of Particle Size Distribution of Metallic Powder on the Conductivity of Thermosetting Conductive Paste.
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy
Alloys
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