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Publications by Akio Katsumata
Semiconductor Packaging Technology for 3D Assembly
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Aftershock Observation of the 2004 Off the Kii Peninsula Earthquake Using Ocean Bottom Seismometers
Papers in Meteorology and Geophysics
Atmospheric Science
Geophysics
Related publications
Recent Activities in Semiconductor Packaging Technology
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Special Articles: Theme of Advanced Assembly and Packaging Technology. Breakthrough in Packaging Technology.
Circuit Technology
Microelectronics Packaging Technology Roadmaps, Assembly Reliability, and Prognostics
Facta universitatis - series: Electronics and Energetics
Packaging Predictable Assembly With Prediction-Enabled Component Technology
Co-Fired AlN–TiN Assembly as a New Substrate Technology for High-Temperature Power Electronics Packaging
Ceramics International
Surfaces
Optical
Materials Chemistry
Process Chemistry
Technology
Magnetic Materials
Films
Composites
Electronic
Coatings
Ceramics
Directed Self Assembly Materials for Semiconductor Lithography
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Preliminary Research on the 3D Printing Technology in the Indoor Soft Packaging Design
Introduction: Semiconductor Technology and Semiconductor Physics
Physics and High Technology
3d-Printed End-Of-Arm for Smarter Packaging
Laser Technik Journal
